The latest overlay I did:

https://is.gd/7HRkOq

Fat Agnus/CSG8375R0 Metal vs. Poly

While the vast majority of TED chips for the plus/4, C16 series was

Revision 2 of the 8360 chip there's also a revision 3 out in the wild:

https://is.gd/wnXAU7

In case you want to see a side-by-side comparison of the

8360R2 vs. 8360R3:

https://is.gd/eybQeV

I can't see any changes jumping out at me, other than the addition of the mask copyright. Presumably the behavioural difference is known? Or is it a difference in quality, in some way?

So far I think the ESD protection at the pads was changed and a the back-bias generator was changed very(!) slightly.

Apart from that I didn't see anything else - but I didn't take a look at full resolution yet.


My guess is that it was just a change for a different manufacturing process. Note: the R2 was introduced 1984
and the R3 apparently 1986 and MOS migrated from NMOS to HMOS-I and HMOS-II inbetween IIRC.

MOS/CSG did the same with the 6581 which had almost identical layouts from R2 to R3 and R4. Only changes for
the manufacturing process (e.g. die shrink).

Here's a comparison of the

CSG8501R4 vs. MOS6509R7 die:

https://is.gd/9VbUjo

The 2nd most important chip:

https://is.gd/bITbIm

6581R4AR metal + poly layer

Here's some comparison of the PAL vs NTSC version
of the VIC-II:

https://is.gd/PYsfv9

Finally the PAL VIC-II:

https://is.gd/ZvoqC3

Just for the sake of it I started vectorizing the 6509R7:

A new comparison:

https://cdn.knightlab.com/libs/juxtapos ... a7ff2ee17c