Dr Jefyll wrote:
Solater wrote:
Won't the heat damage it?
For various other reasons though, I, too, recommend a hot iron. It was a surprise to our production people when I showed that soldering a plastic switch years ago resulted in less melting and damage if they would use a hotter soldering iron so as to be able to complete the job so quickly there wasn't time for the heat to reach the plastic before everything was cooling again.
Now about the capacitor soldered on the top of the IC: I recommend eliminating the curves and taking the leads diagonally across the top as straight and short as possible, to reduce inductance. It won't be any additional work; in fact, it may be less work. Somewhere I have a couple of pictures I wanted to show of something from my work 25 years ago where we had to scab a multilayer ceramic capacitor on the back of a board, but I can't find them at the moment. Maybe later I'll remember where I filed them. What happened was that when the production people tried to be neat and leave an eighth of an inch of leads between the body of the capacitor and where they bent outward, the circuit didn't always work. I had to stress to them the importance of bending the leads right at the body of the capacitor (but without risking breaking the capacitor inside), to minimize the series inductance. This matter of inductance in our digital circuits with fast rise times can be a real stinker, and gets many hobbyists in trouble.