1080p PVB Custom Build #2: PVBV2

[ElEctric_EyE]

After this simple task, I press this button to Generate netlist from Eeschema. And off I am to start designing in PCBnew!
If there are any warnings on a design this simple, try as I have done and assign a value to the reference value field. Do this by pressing 'E' while the mouse pointer is over the desired component that needs Editing. In my example, I had to assign U1 to the ferrite bead, and U6 to the Vreg.

KiCAD works best when hotkeys have been user-assigned!
Remember this, because it makes VIA assignments much easier when switching from plane to plane!
Watch Chris Gammel explain this fact on one of his Youtube Videos.

[ElEctric_EyE]

So far a Netlist has been generated for a very complicated 6-layer design.
Next is to run 'CvPcb'.
It creates a .cmp file for PCBnew. It is the bridge from schematic to layout.

Since the schematic is simple, you can see this footprint assignment process is very simple as well, but there are lots of choices.
More tomorrow...

[GARTHWILSON]

GARTHWILSON wrote:

Nothing silkscreened should go onto a hole, as it makes a bunch of the silkscreened paste squish through, whether solderpaste or soldermask. This is why you don't put vias in solder pads (unless you actually want a mess ). I was able to violate that rule on my memory modules because I solder them by hand, and I don't silkscreen solder paste onto them. I have no knowledge or experience in laying out boards for BGAs, but I suppose the chance of bridges underneath one would be greater if vias' rings are not masked; but then again you would want to put soldermask only on the ring, not pump it down the hole.

I found out something neat from a supplier yesterday. They now have a way to put vias in the SMT pads of a PC board without causing problems during assembly. It costs another $300 for the lot, but if we need the board smaller, putting the vias in the pads saves space. What I'm thinking of in your case EE (although the cost will be too high for many hobbyists) is your BGAs.

If you can put the via in a pad for a surface-mount part, you can save room. The problem used to be that a stencil was used for getting the solder paste on the SMT pads, and if there was a hole in the pad, a bunch of solder paste would squirt through the hold and make a mess. Now this board house can put a via in the pad, then put a plug in the hole after it's plated thru, then plate over the plug too, so mechanically it's like there's no via at all, except you've made the connection to one more other layers at that point, under the pad.

Additionally, instead of screening the solder paste on before applying the parts with the pick-and-place machine, they're using a process like ink jet to print the solder paste onto the board, so they don't have to make the stencil anymore. That saves a little NRE charge. I imagine it saves some solder paste too.

[ElEctric_EyE]

Garth, haha! Been awhile. Thanks for updating this post, sorry I'm late... I will investigate that , I think I did b4? here: viewtopic.php?f=10&t=2070.
For hand assembly of BGA boards, filling VIAs by hand may be an idea I might try still using the ExpressPCB service. I'm still pressing their customer service to add an option to 'tent' their VIAs, i.e. soldermask over the via outer ring, so BGA pads won't short during manual mounting a BGA package...

I still have a burning desire to incorporate the latest 1080p design and make progress on it: viewtopic.php?f=10&t=3244

[ElEctric_EyE]

Eurocircuits, who I've had my eye on for 6 layer PCB design, has http://www.eurocircuits.com/blog/kicad-design-rules/"endorsed" KiCad, the free PCB design tool.