Re: How did MOS design and photomask technology evolve?
Posted: Tue Oct 09, 2018 8:12 am
dwight wrote:
Wires, aluminum or gold, were put down with sonic welders, not soldered.
Well, I was joking, of course.
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How did MOS design and photomask technology evolve?
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Re: How did MOS design and photomask technology evolve?
Posted: Wed Oct 10, 2018 1:28 pm
The ball bonder we have is a general wire soldering machine that uses High voltage to form the ball, then ultrasound to weld it in place. The standard wire is 25mil gold.
Edit: Also from my experience on decapping a 6560, it was bonded with gold wires of approximately the same size.
I also found a MOS 2050 SRAM wafer on ebay:
Too expensive for me, but the seller claims that its a 2inch wafer from 1970.
Edit: Also from my experience on decapping a 6560, it was bonded with gold wires of approximately the same size.
I also found a MOS 2050 SRAM wafer on ebay:
- MOS2050 wafer
Re: How did MOS design and photomask technology evolve?
Posted: Thu Oct 11, 2018 6:32 am
I have also located full wafers of 6502, 6510 and 6561. I am waiting for details about size and revision. They are all very expensive.