well that luck didn't last very long.
today work was a lot more stressful than expected, so i only had the last 1.5h of the day to work on the SBC, i only got this far:
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and most of that time was battling with the SRAM IC (SOJ package).
I honestly have no idea how i'm supposed to solder those. the pads are too small so i cannot even touch them with the soldering iron to put any solder on them (next revision will have new footprints with longer pads), and putting solder on each lead won't work either as it doesn't just flow down towards the pad.
i tried the flooding technique i read somewhere on here (where you hold the board vertical and drag the solder downwards with gravity) and while that it somewhat work, a lot of leads were still not connected and i had some solder stuck between 2 pads where it was really really difficult to remove from. (maybe i didn't use enough solder? not sure)
I only have a regular soldering station with a few tips. i do also have a hot air gun, but nothing to hold the IC in place while blasting it with air (plus i have no soldering paste)
so what's the trick with these? i would really like to continue using these SOJ SRAM IC in the future due to their speed and capacity, so i'm hoping there is a way to do it more easily.
and would larger/longer pads actually help (though i won't be ordering new PCBs just yet, i still want to get this one up and running).
some close up images (i only have my phone with 8x zoom, so they're pretty blurry):
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