I suppose it's inevitable that some of these older package types will be discontinued. They do require more materials to implement. The move to eliminate them is driven partly by cost and the continued shift to higher levels of integration that can only be achieved through the use of smaller packages which likely leads to reduced demand for PLCC-packaged components.
On the bright side, the lack of a socket for the QFP packages likely means that some additional reflection will be required in regards to the design and the layout before releasing boards for fabrication.
On the not so bright side, I'll probably have to start redesigning some of the legacy products we support if we want to keep them in production.