BigEd wrote:
You did well to desolder parts with so many pins!
Yes, I used the hot plate for those 2. After about 20 seconds they came off very even and clean. My confidence was high that I could reuse them, since they weren't overtly abused by heat.
Yesterday I soldered in the 48-pin QFP videoDAC and associated passives, 2 SyncRAM's (1 for each S6), the pullup resistors for I2C, the VGA connector and 3 ferrite beads which are used as power supply filters to some IC's. There is 1 ferrite bead used for the videoDAC and 2 for the digital audio transceiver. Then the board got another ultrasonic clean in 91% isopropyl alcohol. Then I packaged it in an anti-static bag.
As I progress, I find myself gravitating towards a different technique. I use liquid flux now, the ChipQuik CQ4LF-1.0 and fluxless .015" silver bearing solder. This is the way to go! No solder bridges. I hate them! I prefer quick, clean and neat. No cleaning up messes...
Anyway, today after work, I unpacked the board hooked up the 5V main and threw the PS switch. Last time I did this I heard a pop and a ferrite bead jumped off the board! I was fully expecting smoke. But none. And ISE 14.7 saw the S6 and SPI PROMs!
This is a milestone. I can now begin to configure the constraints file to assign FPGA pins to the SyncRAMs and videoDAC. I already have a project to do an initial test.
A sidenote: The Si514 has a slightly different pinout than the Si570. The I2C signals are on different pins. Luckily, the pad spacing is the same for the power and Freq out. I may be able to correct this without ordering new boards.
A pic of the top board as it progresses. Nothing much changed on the bottom yet.