I've started this thread because I need to get some thoughts out of my head and into reality before I forget. I need to make room for other logical thoughts and I don't want to forget, which seems to be happening more often now.
In the past, I would've done this on paper, but doing so within this forum has proven to be more productive, with all the most valuable input I get from seasoned engineers and other specialists.
.......
I plan to continue to use
expresspcb service to make the new boards. I've gotten used to their software, and the resolution is very respectable at .001". In v1.1, 3
4-layer miniboard Pro boards were done close to perfection. I had only
1 issue, Arlet had found after receiving his board, where the software did not detect a problem with a via and trace being too close together. It affected operation of the I2C lines. I think my design violated the spec of .015" between only 1 via and trace. Note, that the design also was pushing the max of 350 holes for this service. The software had detected other similar issues during the design...
Anyway, these miniboard Pro boards for v1.1 of the Dev. Board were 3.8"x2.5" at a respectable $98US for 3 identical boards. I have 1 fresh untouched/unpopulated board left. PM if interested.
For v1.2, I plan to use expressPCB's 4-layer ProtoPro service. These boards can have a max of 650 holes! Also, the new boards go up to 21sq" rectangle, with no side exceeding 12". I'll receive 4 boards for $195US. These new boards
could have a config of 5"x4.2". This would support a backplane type of interconnect system 'amongst' boards. In v1.1 only 1 daughterboard at a time was planned to be plugged in.
This 21square inch rectangle size is what I'm currently working on in my spare time, in order to accomodate some more useful ICs, features, and header interconnects.
Any feedback always welcome! and more details to come.