I agree, very conservative which is good!

My only point being, the QFP package will probably be LESS conservative with the spec's, as it has less surface area, than the PLCC, to dissipate any kind of heat...

I'd be the first to try... Are the QFP's really for sale?

_________________
65Org16:https://github.com/ElEctric-EyE/verilog-6502

In a package that small with so many leads, the primary path for the heat getting out is often the leads, not the package itself; and the PQFP will have less lead length from the die to the outside of the package than the PLCC does. The heat goes out the leads and into the board. There may not be much difference. I don't see any thermal resistance specification in the data sheet.

QFP apparently not available... I was mistaken.

Though, the datasheet has been revised to include the new QFP pinout... Maybe they are thinking of re-releasing it?
If not, onwards with the CORES!

_________________
65Org16:https://github.com/ElEctric-EyE/verilog-6502