It sounds like you get it! I have not found very good diagrams on the web to link to to illustrate some of the concepts of what goes on at the higher frequencies, so I might have to take the time to draw some, because it seems to be difficult for many people to grasp.
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If I have both power and ground plane, [so] should I still be using bypass capacitors? Given both power and ground planes, would using SMT capacitors for bypassing make sense?
My understanding (which I would like to confirm) is that a closely spaced, infinite parallel power and ground plane pair have no inductance from one point to another, which would mean we wouldn't need a capacitor at every IC. We cannot make it infinite of course, and the negative effects are the worst as we get close to the edge of the board. Also, vias have inductance, and the foil has some skin effect. These latter two are probably too small to worry about at any frequencies you'll be confronting with off-the-shelf 65-family parts and 74HC (you might as well go to 74AC which is much faster); but adding a chip capacitor from each Vdd lead to the ground plane around it can only help, and it costs next to nothing, takes no space on the type of board you mention, and is not much labor, so why not do it. If you can make them chip capacitors (0603 or even 0402 if you have the soldering-iron tip and the steadiness for it), then do, because you don't want any extra inductance from leads. The nice thing about the proto board you mention is that with the thru-plated holes and the ground plane, you can solder one end of the capacitor to the pin and the other to the plane, and the fact that the socket pin gets soldered to the pad means that mechanical stress won't be transferred to the capacitor. You still can't get rid of the inductance from the board to the IC's die (with the socket, pin, and bondwire), but the PLCCs shorten the connection from the board to the die, and offer more ground and Vdd pins than the DIP does.
With 1-2MHz parts you can get away with murder; but you have to start paying attention to these things as you get into the higher speeds of 10-20MHz and beyond.
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specifies .01uF caps. Would .1uF caps also work?
.01 will raise the self-resonance frequency, but ideally you get rid of all the inductance so that's not an issue, and that's partly what chip capacitors are for. You cannot get rid of all of it, but chip capacitors' inductance will be sufficiently low for this purpose that Dr. Howard Johnson says there's no harm in going up to the .1's if they're in the same package size.
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is there anything else that I should be reading or keeping in mind?
Regarding construction for good AC performance? Or something else?