anyway all that broken late 1970s and 1980s stuff is a good indication on 'what not to do' in new systems
so far we have got:
- electrolytic capacitors (just use foil capacitors, who gives a crap about the 20 cents each extra if they last for centuries)
- dram (although some sram also seems to have died that usually was linked to 'voltage abuse' or chemical problems
- not properly isolated connectors to the outside world
- potted in power supplies
- mylar (keyboards, or anywhere else)
- edge connectors, ENIG or otherwise, they just rot away while you look at them, no matter how much gold you put into them.
- non socketed ic's (although use the more expensive gold plated sockets with the small round hole as the other ones tend to 'creep out' over the years, also the other ones turn green when oxidizing and sometimes lose contact)
- cercaps of which the legs can bend over pcb traces (that means you commodore
- cardboard 'rf shielding' (that means you commodore - although on most of the c16 series they did it properly for a change, probably took an atari xl/xe apart to spy on them
- 'nintendo' top loading cartridges (oh wait, also see the edge connectors part
- mechanical drives as a whole but anything with a belt in it in specific.
- switched power supplies (not entirely sure what the goal with those was, but just buying a lump of copper is cheaper and safer and lasts longer)
- rohs (generally, rohs is just crap. 'lead' isn't a 'hazardous substance' lead is a natural element. and it just so happens to do a pretty good job at keeping electronics together so we keep it around. it won't make you die unless you mix it into your food anyway.
- 1970s 'brown' moist-sucking-up pcbs that 'self expand' over the years, breaking contacts. (no idea what they were made of, probably compressed cardboard, but they're quite common in older transmitters and consumer electronics, as well as some cheaper (even cheaper than a c64) computers up to the mid 1980s)
- anything smd ( 1) held in place only by the pcb traces 2) subject to moist getting under the ic and expanding/freezing there 3) hard to repair/replace in the field 4) no need to make things smaller that go into a huge case anyway)
- bga: just horrid. it is simply -physically impossible- to use bga packages -and- expect your product to work 2 years onwards.
- anything glued in place or held in place with double sided tape or sticky tape (apple)
- bromeates either used in chip packages (where their leakage affects the chip die) or outside casing (where it causes discoloring), use some other fire retardant or ceramic chip packages and metal cases.
all those 'youtube repair' videos make very clear who has been deliberately selling broken-by-design crap over the past decades by just running statistics. lol. stuff that previously was only known to repair centers frequently handling product x of manufacturer y, (and apple and such don't like it being exposed one bit
they also make very clear how to not design new products.